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Friday Newsletter
Latest
13th June 2025
Exclusive Webinar: Smart Buildings: Connected Spaces, Smarter Places with KORE
Register now
Join us for the third session in our Innovation of Things webinar series as we explore how IoT is transforming construction, real estate, and facility management. From energy-efficient buildings to secure construction sites, discover how IoT-enabled systems improve safety, streamline operations, and enhance occupant experiences. Learn how data from connected sensors is shaping the future of smart spaces.
Automotive
13th June 2025
Advancing your journey toward embedded software development
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Our approach to software focuses on speed, interoperability and scalability, helping you get to market faster. Whether you are developing the latest software for automotive, robotics, or healthcare, we have the expert codewriting tools, repositories and support you need.
Podcasts
13th June 2025
Series 18 – Episode 6 – memory at the core of innovation
Listen now
Paige West speaks with Steve Shih, Automotive and Embedded Product Manager, Silicon Motion about memory being at the core of innovation and, in particular, how it’s transforming the industrial and automotive sectors.
Cyber Security
13th June 2025
Infineon launches latest security controller
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Since its introduction, over 10 billion security controllers based on Integrity Guard security architecture by Infineon Technologies have been delivered – marking a major milestone in the architecture’s global adoption.
Quantum Tech
13th June 2025
Orange and Toshiba launch quantum-safe network service
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Orange Business and Toshiba Europe have partnered to launch the first quantum-safe networking service based in Paris, France.
Events News
13th June 2025
Kurtz Ersa announces training courses
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Kurtz Ersa is proud to announce two upcoming advanced training courses focused on the VERSAFLOW 3 selective soldering system, scheduled to take place in July 2025 at the company’s US headquarters in Plymouth, Wisconsin.
Production
13th June 2025
Nordson develops panel-level packaging solution
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Nordson Electronics Solutions has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.
News & Analysis
13th June 2025
Synopsys achieves PCIe 6.x interoperability with Broadcom's PEX90000 series switch
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Synopsys has announced that its collaboration with Broadcom has achieved interoperability between Synopsys' PCIe 6.x IP solution and Broadcom's PEX90000 series switch. As a cornerstone of next-generation AI infrastructures, PCIe switches play a critical role in enabling the scalability required to meet the demands of modern AI workloads.
Industrial
13th June 2025
parts2clean 2025: higher demands on component cleaning
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Specifications calling for stricter cleanliness for parts and components, greater demands for cost-effective cleaning, and more exacting requirements for energy and resource-efficiency in processes – industrial component cleaning is facing a variety of challenges.
Power
13th June 2025
Switching regulators bring up to 98% efficiency
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The MSR7805M, MSR7805BW, MSR7810BW, and MSR7820CW series from MicroPower Direct are ultra-compact SIP3 switching regulators designed to replace inefficient linear regulators in embedded systems.
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